Xiaomi will release smartphones with ‘Loop LiquidCool’ vapor chambers in 2022

Xiaomi has developed a new smartphone cooling system. The Chinese company calls it Loop Liquidcool and it consists of two separate segments for gas and liquid. Xiaomi claims to be able to achieve temperatures that are 5 degrees lower under load.

In a video, Xiaomi shows a modified Mi Mix 4, which is compared with a stock Mi Mix 4. The smartphone has a Qualcomm Snapdragon 888+ on board. Under load, the modified Mi Mix 4 stays up to 5 degrees cooler than the stock variant. It is somewhat confusing that Xiaomi speaks in the text of a difference of 8.6 degrees Celsius.

The heat sink consists of a circuit, through which the thermal energy moves in a single direction. The liquid must evaporate due to the heat on the heatsink and continue as a gas in the circuit. Further down the circuit are what Xiaomi calls ‘Tesla Valves’, a ‘valve’ that allows liquid to flow in the desired direction but holds back gas. In other heatpipe designs, gases and liquids mix with each other, and Xiaomi claims that avoiding this doubles the effectiveness of the cooling.

The tech giant also reports that the circuit is customizable in its shape, making it easy to make room for the other components in a phone. Xiaomi aims to launch the first smartphones with the technology in the second half of 2022.