Toshiba introduces emmc 5.1 and ufs 2.1 memory modules

Toshiba announces new embedded emmc 5.1 and ufs 2.1 memory modules, with capacities from 16 to 128GB. The modules use Toshiba’s 15nm MLC NAND memory and can be used by manufacturers in devices such as smartphones.

According to Toshiba, the emmc modules are based on the 5.1 specification from standards organization Jedec and the ufs storage modules conform to the 2.1 specifications. Toshiba supplies the ufs modules with capacities from 32 to 128GB. The maximum sequential read and write speeds are 850 and 180MB/s, according to the manufacturer an improvement of 40 and 16 percent respectively over its previous modules. When it comes to random reads and writes, performance would be 120 and 80 percent better.

Toshiba supplies the emmc memory, which uses a parallel interface, in capacities from 16 to 128GB. The sequential read speed is up to 320MB/s, while writing at 180MB/s is possible. According to Toshiba, that is a 20 percent improvement over the previous generation. Random read and write performance has improved by 100 and 140 percent, the manufacturer claims.

Embedded memory modules are not only used in smartphones, but also in tablets and some laptops. In addition to nand memory, the modules contain an integrated controller that handles processes such as bad block management, error correction, wear leveling and garbage collection.

Samsung announced its ufs 2.0 memory modules at the beginning of this year, which enable read and write speeds of up to 850 and 320MB/s. SK Hynix also makes UFS memory modules. Almost all smartphone manufacturers use ufs modules in their high-end smartphones. Apple solders separate memory chips to the motherboards of its iPhones and uses a separate memory controller.