SK Hynix starts mass production of hbm2e memory

SK Hynix has started producing hbm2e drama on a large scale. The company announced in August that it was in the process of producing this memory. Hbm2e memory offers faster speeds compared to regular Hbm2 memory.

SK Hynix announces the start of hbm2e mass production in a blog post. The company already announced in August that it was working on hbm2e memory. At the time, it was not yet known when the company would start large-scale production.

SK Hynix’s hbm2e chips offer a maximum bandwidth of 3.6Gbit/s per pin. That equates to a bandwidth of 460GB/s for the complete stack. As previously announced, the memory manufacturer stacks eight 16Gbit chips on top of each other with through silicon vias. This brings the total capacity to 16GB per stack. With the company’s regular hbm2 chips, the capacity was still 8GB per stack.

The new dram chips are also more energy efficient and smaller than the current hbm2 memory, the South Korean company reports. According to SK Hynix, the memory chips are suitable for high-performance computing, deep learning, or artificial intelligence systems, among other things. SK Hynix also expects hbm2e memory to be used in exascale supercomputers.

SK Hynix is ​​not the first company to work on hbm2e memory. Earlier this year, Samsung released a hbm2e chip. Called Flashbolt by Samsung, this memory has a capacity of 16GB per stack and a maximum bandwidth of 3.2Gbit/s per pin. This allows the complete stack to achieve a bandwidth of up to 410GB/s. Memory manufacturer Micron is currently working on regular hbm2 memory, and expects to release it this year.