SK hynix develops HBM3e memory modules with bandwidths up to 1.15TB/s

SK hynix has developed its first HBM3e chips. According to the company, these memory modules offer bandwidths of up to 1.15TB/s. SK hynix now delivers samples to customers. HBM3e will be generally available in the first half of next year, SK hynix said previously.

Source: SK hynix

SK hynix has developed its HBM3e memory chips said to be completed. The chips offer bandwidths approximately 40 percent higher than the company’s current HBM3 modules, which achieve bandwidths of up to 819GB/s. SK hynix claims in its press release that the chips have ‘the best specifications in the world’, although Micron recently developed HBM3 Gen2 chips with bandwidths of 1.20TB/s.

The new chips also come with a “ten percent improvement” in heat dissipation, according to SK hynix, and are backwards compatible with the company’s current HBM3 chips. Current HBM3 products can therefore be equipped with faster HBM3e chips upon release without further adjustments.

HBM, also called High Bandwidth Memory, offers relatively high bandwidths, as the name suggests. The memory is mainly used in video cards; AMD previously used such chips in its R9 Fury GPUs, although HBM is mainly used in data center GPUs these days. Intel also introduced versions of its Sapphire Rapids server processors with integrated HBM2e at the end of last year.