SK Hynix begins mass-producing memory at 16nm

SK Hynix has started mass production of 64Gb 16nm nandflash. The manufacturer will also use the memory for 128GB MLC chips, which should be on the market early next year. The manufacturer uses its Air-Gap technology for production.

SK Hynix say has actually been producing nand memory at 16nm since June, but the new generation would offer cost advantages due to the smaller chip size. The production of the 64bit MLC chips should be followed early next year by that of 128Gb chips.

To prevent interference between the memory cells, an increasing problem with smaller processes, Hynix shields the circuits with vacuum isolation holes, a technique the company calls Air-Gap. With 16nm production, the limit for 2d chips seems to have been reached. Manufacturers are therefore switching to stacking layers in 3D chips; Hynix also says it wants to accelerate its development and boost TLC production.

Earlier this year, Skyera said it already wanted to use the 16nm memory for its enterprise storage media in the SkyEagle line. In time, the nand-flash should also come to consumer SSDs, USB sticks, memory cards and mobile devices. Others previously indicated that competitor Micron would like to start mass production at 16nm in the last quarter of 2013.