MediaTek Introduces Dimensity 8100 and 8000-5nm SoCs for Smartphones

MediaTek introduces two new smartphone chips in its Dimensity series. The Dimensity 8100 and 8000 are produced by TSMC at 5nm and receive 5G support. Phones with these chips should appear this quarter.

MediaTek equips the Dimensity 8100 with four Arm Cortex-A78 cores at 2.85GHz and four A55 cores at 2.00GHz. The Dimensity 8000 has the same cores, although the A78 cores are clocked at 2.75GHz. Both chips also have the same Arm Mali-G610 MC6 GPU, although this is also clocked higher in the Dimensity 8100. The chips also support Lpddr5-6400 memory and UFS 3.1 storage. The chips also have an integrated chip for AI computing tasks. MediaTek says it is clocked 25 percent higher than the previous generation, but shares few concrete details.

Both chips in the Dimensity 8000 series further support 168Hz displays at full HD+ resolution, although the Dimensity 8100 also supports wqhd+ displays at 120Hz. In addition, the socs have Bluetooth 5.3 and Wi-Fi 6E, in addition to support for 5G on sub-6GHz frequencies. MediaTek’s new SOCs support camera sensors with resolutions of up to 200 megapixels and can process 4k videos with HDR10+ and frame rates of 60fps.

The first smartphones with the new soc should appear in the first quarter of this year. It is not yet known which smartphones that are. The new chips are positioned under the MediaTek Dimensity 9000, which includes a newer generation of cores and is produced on TSMC’s 4nm process.