MediaTek announces 4nm-Dimensity 8200-soc for smartphones

MediaTek has announced the Dimensity 8200. That is a soc for smartphones that is baked on a 4nm process from TSMC. The Dimensity 8200 has eight cores, which are divided into three clusters. The chipset supports a 320-megapixel camera sensor.

One of the clusters contains an Arm Cortex A78 core running at 3.1GHz. A second cluster contains three A78 cores running at 3GHz and a third cluster contains four A55 cores running at 2GHz. The CPU of the Dimension 8200 received 4 MB of L3 cache memory. The chipset also includes quad-channel Lpddr5 memory and works with UFS 3.1 nandflash. In terms of connectivity, the Dimensity 8200 offers support for tri-band Wi-Fi 6E, Bluetooth 5.3 and Sub-6GHz 5G.

The soc contains a Mali G610 GPU with six cores and a MediaTek APU 580 for AI tasks. The Imagiq 785-isp offers support for a 320-megapixel camera sensor and video recording in 4k and 14bit-hdr. The soc also allows for simultaneous HDR video recordings via three sensors. Subject focus tracking can also be used during filming and a bokeh effect can be added.

MediaTek has also equipped the soc with HyperEngine 6.0. This should improve game performance. Via Display Sync 2.0, the refresh rate of the screen can also be adjusted to the frames per second in the game. The soc supports wqhd+ displays with a maximum refresh rate of 120Hz, and full-hd+ displays with a maximum refresh rate of 180Hz.

MediaTek Dimension 8200