MediaTek announces 4nm Dimension 8200 SoC for smartphones

MediaTek has announced the Dimensity 8200. That is a SoC for smartphones that is built on a 4nm process from TSMC. The Dimensity 8200 has eight cores, which are divided into three clusters. The chipset supports a 320-megapixel camera sensor.

One of the clusters contains an Arm Cortex A78 core running at 3.1GHz. A second cluster contains three A78 cores running at 3GHz and a third cluster contains four A55 cores running at 2GHz. The CPU of the Dimension 8200 received 4MB of L3 cache memory. The chipset also contains quad-channel Lpddr5 memory and works with UFS 3.1 nand flash. In terms of connectivity, the Dimensity 8200 offers support for tri-band Wi-Fi 6E, Bluetooth 5.3 and Sub-6GHz 5G.

The SoC contains a Mali G610 GPU with six cores and a MediaTek APU 580 for AI tasks. The Imagiq 785-isp offers support for a 320-megapixel camera sensor and video recording in 4K and 14-bit HDR. The SoC also allows you to make HDR video recordings simultaneously via three sensors. During filming, subject focus tracking can also be used and a bokeh effect can be added.

MediaTek has also equipped the SoC with HyperEngine 6.0. This should improve game performance. Via Display Sync 2.0, the refresh rate of the screen can also be adjusted to the frames per second in the game. The SoC supports WQHD+ displays with a maximum refresh rate of 120Hz, and Full HD+ displays with a maximum refresh rate of 180Hz.

MediaTek Dimensity 8200