Western Digital presents 3D QLC NAND memory module with 2Tb of storage space

Western Digital has presented a new generation of 3D QLC NAND memory module. The module has 2Tb of storage space on board and is aimed at data centers and AI applications.

CEO Robert Soderbery presented the memory module at a recent company financial meeting. The Executive Vice President of Western Digital claims that the memory chip will be officially introduced soon, although it is not clear exactly when.

Soderbery's presentation shows that it concerns a BiCS8 memory module. This new generation of memory modules allows, among other things, 218-layer 3D QLC NAND memory. The memory density of the new chip is said to have increased by 50 percent compared to the previous generation of 3D QLC NAND memory chips from Western Digital; speed is also said to have increased by 80 percent. Western Digital has not yet shared data showing the exact speed at which bits can be read and written. It is also not yet clear how energy efficient the new memory module actually is.